Worked closely with the Fab Engineers to come up with qualifications, creating reports, and failure analysis. Details of QSFP: Writing technical documents for product line, Testing of 40Gig Modules, Assembly of 40Gig Modules, Test Data analysis, and maintenance of WIP tracking logs. Real time feedback to Engineering and Upper Management based on Yields and daily progress. Responsible of transferring Burn-In of TO products to Taiwan, which included building and shipping of Burn-In test station and installation at contract manufacture facility in Taiwan. Responsible for maintenance of auto-aligner, daily qualification and troubleshooting. Module Reliability testing and analysis.level of quality. I was responsible for converting electronic documentation to newer formats and keeping documentation up to date through engineering request changes.
I was the shift lead for the TSA production line, overseeing a team of 8 people and was responsible for the daily operations of the group with regards to meeting productions demands on time and with a high level of quality. Previously, for 3 years, I was the team lead for the Wafer Qualification group. I was responsible for the daily operations of this group and was assigned to maintain all electronic documentation and Excel spreadsheets for both the Wafer Qualification group and the Packaging Group. I represented the Wafer Qualification Group for weekly Process Area Reviews and provided all metrics for both Wafer Qualification Group and Packaging Group for these reviews. I worked with outside vendors to secure parts and materials required for daily operations and attended all required meetings as the representative for the Wafer Qualification Group. Additionally, I was trained as a process area technician for the 10Gig production line and was responsible for qualifying, calibrating, troubleshooting, and maintaining test equipment for this product line.
Lead technician responsible for the electro-mechanical assembly, testing and documentation of the high voltage power supplies and trigger boxes, which were part of an anti Improvised Explosive Device (IED) project. Implemented an initial tracking system for traceability of both the subassemblies and completed chassis. Performed thru-hole and SMT soldering of production printed circuit board assemblies. Performed QA evaluations of the board level soldering and assembly done by co-workers.
Project Technician: for ATK Mission Research's Clock Driver MCM project. Responsible for performing electrical/functionality test of Clock Drivers, visual inspection of wafers, substrates, individual die, troubleshooting test failures, and wafer/die probing. Other tasks included maintaining database, data evaluation, updating process documentation and assist with training activities. Took ownership of the management of parts and sundries inventory, which included writing, submitting, and tracking purchase requisitions, inventory, tracking, shipping and receiving. Served as the key contact for initiating or resolving issues with customers and suppliers. Characterization Test Technician: for ATK Mission Research's APHY project. Responsible for accurately performing and documenting characterization tests within specified time frame.
Responsible for the electro-mechanical assembly and documentation of the electronics portions of the liquid and gas flow calibration stands and provers for companies such as Northrup Grumman, Haliburton, AF Metrology Calibration, National Institute of Standards in Technology (NIST), Gilbarco, Redstone Arsenal, and other military installations. Performed trouble-shooting and custom modifications on a wide variety of electronic and electrical equipment. Fabricated most of the electrical subassemblies, and performed both the prototyping of circuit boards, as well as thru-hole and SMT soldering of production printed circuit boards.
Project Management emphasis
Operations, Production Line, Wafer Handling, Packaging, Team Lead, Electro-mechanical assembly, Mechanical assembly, Printed Circuit Board SMT and Thru Hole Soldering, Calibration, Prototyping, Trouble-shooting, Test, Inspection, Inventory, Process Documentation, Training, Visual Inspection, Cleanroom, Data Analysis, Data Collection, Process Improvement.
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Job Titles Held: