Experienced 1st-line Engineering Manager with 6+ years managerial experience leading a Product Engineering team. Led team responsible for final chip design assembly, verification, and introduction into Manufacturing for a 1Billion+ semiconductor business. Proven track record for achieving First Time Right designs with aggressive, competitive turn around times in a virtual 24 x 7 business. Strong leadership and relationship-building skills. Led problem resolution and continuous process improvements involving inter-departmental teams, global resources, and clients. Calm and poised in high-pressure situations typical of the business. Thorough and dependable with excellent written and interpersonal communication skills.
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Managed ASIC Product Engineering team responsible for final chip design assembly, verification, and release to Manufacturing. Deliverables to the business included workflow design & development for the release process, software development to implement the release process, and generation of Test manufacturing pattern data for final wafer and module test. Led team to significant reduction of First Time Wrong incidents during my tenure.
Co-Team leader responsible for architecture, development, maintenance, and support of ASIC chip release process for new and existing product offerings (and overall product offering qualification). Involved Cross-departmental collaboration, development, and problem solving.
Member of ASIC Product Engineering team responsible for development and execution of final chip assembly process for IBM's fledgling ASIC business. Developed database for managing operations of ASIC Release flow, including Manufacturing preparation and release tasks, results, and metrics. Ascended to PE Team lead prior to departure to Methodology team.
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