GLOBAL PAD CONDITIONER TEAM LEADER/TRIZACT CMP APPLICATIONS EXPERT/ TECHNICAL MANAGER
Highly experienced, influential high performer working in R&D and manufacturing in chemical and high technology industries. A key player in the development of new process technologies to drive operational excellence and reduce cost. A technologist at 3M Company with a solid track record in innovation and solving problems by constantly applying and creating new ideas. A solid record of building relationships with professionals at all levels from management to partners and customers. Broad experience in large corporations and in driving groundbreaking advancement within the semiconductor-manufacturing sector through startups and technology innovation. Won technical awards at Dow Chemical, Motorola, Freescale and 3M including the prestigious 3M CTE&I team award for technical excellence and innovation.
EMMD Lab, 3M CenterSt. Paul, MNGlobal Pad Conditioner Team Leader/Trizact CMP Applications Expert/ Technical Manager
Recruited to develop a new pad conditioner utilizing 3M's Trizact microreplication Chemical Vapor Deposition (CVD) Technology at 3M's EMMD Lab where all of 3M's advanced node semiconductor development and application testing is conducted.
Key Responsibilities Created test methods on the 300 mm AMAT Reflexion, Ebara FREX300 and GnP polishing tools for testing the microreplicated technology.
Hands on operation of CMP tools.
Collaborated with management and business teams setting priorities and strategies for the development and roll out of the Trizact pad conditioner technology.
Organized and conducted demonstrations onsite with 3M's key customers in order to qualify the pad conditioner.
Generated customer packages and devised BKM methods to expedite the qualification and implementation of technology for 10 to 20 nm advanced nodes at major customer sites with projected 20% - 30% increase in market share of 3M in the pad conditioner business.
Customer packages generated using next generation slurries and pads from 3M's key pad and slurry manufacturing partners.
Key Accomplishments Managed and developed 3M's applications lab and testing systems on the 200 and 300 mm AMAT Reflexion polishing tools and Ebara FREX300 tools conducting extensive break-in and marathon run-outs, and testing of 3M's Microreplicated conditioners for front and back end applications in semiconductor wafer processing for EMMD's major customers.
These customers included Micron, IBM, Intel, TSMC, Global Foundries, AMAT and Samsung.
Tasks involved: Generating and presenting technical data for Trizact technology for customers worldwide.
Working in concert with the sales and marketing teams in the generation of new business and sales for 3M's key accounts by increasing electronic sales growth, profitability, and penetration in the electronic semiconductor markets.
In-depth knowledge of electronics and electronic processes for all major customers including Micron, Intel, Samsung and IBM.
An extensive understanding of the product, planning and organizing of the lab to negotiate and sell the product alongside the sales and marketing teams.
Ability to build and maintain C-Level relationships through presenting and influencing executive management at 3M and major customer accounts.
Freescale SemiconductorAustin, TXCMP Process Development Engineer
Process and tool owner of CMP (AMAT Mirra Mesa) of both copper and oxide modules for Freescale's 90 nm magneto-resistive random access memory (MRAM) pilot line in Chandler, AZ and 65 nm microprocessor logic manufacturing line in Austin, TX.
Monitored (as process and tool owner) tool operations in pilot and manufacturing lines adjusting as needed, processes through SPC and fault detection controls systems for the microprocessor and memory fabrications lines.
Qualified new consumables and installed new slurry systems resulting in 30% - 40% improvements in process yield and defects.
MotorolaPhoenix Austin, AZ TXCMP Technical Leader and Scientist
Dow Chemical CompanyPlaquemine, LAProject Leader
University of Akron Auburn UniversityAkron Auburn, OH ALPh.D: Chemical EngineeringChemical Engineering
Wei-tsung Tseng, John Zabasajja, et.al., "Microreplicated Pad Conditioner for Copper and Copper Barrier Applications" , joint paper between IBM Semiconductor and 3M Electronics Materials Division, accepted for presentation Internal Conference of Planarization Technology (ICPT)), Kobe, Japan, Nov 2014. John Zabasajja et.al., "3M Trizact Pad Conditioners for FEOL Tungsten Plug and Metal Gate Applications and Metal Gate Applications", Internal Conference of Planarization Technology (ICPT), Kobe, Japan, Nov ( 2014). Wei-tsung Tseng, John Zabasajja, et.al., "Microreplicated Pad Conditioner for Copper and Copper Barrier Applications" , joint paper between IBM Semiconductor and 3M Electronics Materials Division, CMP Camp, Albany, New York, August ( 2014). John Zabasajja, et. al., "3M's Microreplicated Trizact Pad Conditioner for FEOL Tungsten plug and Metal Gate applications", CMP Users Group, Northern California Chapter of The American Vacuum Society (NCCAVS), March, 2014. John Zabasajja, et.al. "Trizact Pad Conditioners for Front End Applications" (International Conference of Planarization Technology (ICPT)), Hsinchu, Taiwan, Oct 2013 John Zabasajja, et. al.," Microreplicated Pad Conditioner for Barrier Applications" (International Conference of Planarization Technology (ICPT)), Grenoble, France, 15-17 Oct. 2012 John Zabasajja, et.al," Pad Conditioning for Next generation CMP Applications" ( Proceedings of International Conference on Planarization/CMP Technology), Phoenix, AZ, 2011 Patents Non-asbestos Diaphragm Separator, John Zabasajja, et.al. Patent #5685755, Dow Chemical Preparation of Mixed Fiber Composite Structures, John Zabasajja, et.al., Patent #5304330, Auburn University Mixed Fiber Composite structures High Surface Area High Conductivity Mixtures, Patent 5080963, Auburn University