SEARCH

co-project Lead Resume Example

Resume Score: 90%

Love this resume?Build Your Own Now
CO-PROJECT LEAD
Profile

Senior Hardware Design Engineer with over 18 years experience in research and development of Hardware Architecture and hand-on experience performing quality troubleshooting, telecommunication system design and development.


Skills
Management /Leadership: My most value able skill is to manage complex R&D projects. I understand how to bring best out of Engineers and also how to bring project on time. Hardware Design: My Engineering experience in mostly in Hardware Design. I have designed Microwave Radio that includes processors, Gigabit Ethernet, Modulator/Demodulator, DC/DC power supplies, Peripherals, GigE, optical Fiber, OC3, DS1/E1, DS3/E3 etc. Firmware Design: Proficient in VHDL code for FPGA and CPLD. Designed and developed chip (FPGA) design using VERILOG language and schematic entry tools. Embedded Software Design: Done Embedded projects tasks using C/C++ and assembly
Professional Experience
Microwave Networks IncStafford, Texasco-project Lead09/2010 to 03/2015
  • Managing Hardware Engineers responsible to developed hardware, firmware, and test fixtures. I managed schedules, design reviews; also did hands on work in hardware and firmware design. Make sure all the Hardware and firmware meets ETSI, ITUT, and ANSI standard in addition to internal ISO 9000 quality standard. Designed and developed communication hardware and also developed related firmware. Bring all the hardware to production level. Lead and assist software Engineer(s) to write the hardware specification and code for the products. Work closely with Drafters to design high speed board layout. Designed and developed state of the Art Microwave Radio (Proteus MX) that cost 60% less than company existing radios and have features that were never offered before by the company. Designed the most complex 14 layers high speed mainboard. The mainboard includes Gigabit Ethernet interface, Broad com modem, peripherals, and high speed repeater interface. This Project has passed all FCC class B EMI/EMC testing.
  • Test Fixture Improvement Improve the manufacturing testing platform that improve yield of the boards from 65% to 99%. It was done by designing new test fixture and improve test coverage by using JTAG and automated functional test.
  • 128 DS1/E1 SHARP (Self-Healing Automated Repeater Protocol) Project Lead Company most complex hardware, it has 18 layers board and 16 BGA and very high speed signal processing. This project reduce the need of third part equipment that only save $400 K
  • 32 DS1/E1 Line Interface Module (Project Lead) Company first 32 T1/E1, designed from concept to product.
  • Gigabit Ethernet Module (Project Lead) Company first gigabit Ethernet module that support 4 x1000/100/10 BT or 2x1000/100/10 BT + 1 x optical interface. Product can support up to 9k jumbo packets.
  • Microwave Radio Motherboard design Design the mother board using MPC 875, Flash, SDRAM, serial ports, Ethernet port, A/D converter, D/A converter, FPGA, and CPLD etc.
  • Proteus AMT DSx Line Modular Interface: (Project Lead) Developed & designed for 8xDS1, 16xDS1, and 1xDS3 line modular interface (LIM) for the company new generation wireless radio (Proteus AMT). Radio is able to transfer 32xDS1, 24xDS1, 16xDS1, 2xDS3, 8xDS1 and 1xDS3, 16xDS1 and 1xDS3 data rate. The project required modification of coding scheme inside the FPGA depending upon which configuration of LIM is connected with the radio. The radio required the RTOS modification in a way that it can recognize the LIMs when connect to the system. 5, 10, 15, 25 MHz filters are specified for the IF board design. Finally, element manager for the radio required modification for the Domestic rate LIMS.
  • CM 2x100 BaseT & E3 /DS3 SYNDES (Project Lead) This project is based on SONNET OC3 design, it uses OC3 payload to transmit 2x100 Base T channels and 1xDS3 or 1xE3 channel. The available frequency of OC3 is 155M/sec, therefore 1x 100Base T channel is guaranteed 100% through put and the second 100BaseT channel used the remaining frequency leftover by DS3/E3 and first 100 Base T channel. The flow control technique is used in both Ethernet channel to avoid any packet loss. The TDM channel (DS3/E3) phase lock loop is done by DDS clock which provide the PLL up to 100 PPM and better Jitter tolerance and Jitter transfer function. Xilinx Spartan II was used to perform major designing using the VHDL code. Kendin chips were used for 100/10 base T while transwitch DS3/E3 line interface chip was used to provide TDM channel.
  • 24 V to -48 V, 5V, 3.3 V, 1.8 V DC to DC converters: Designed a power supply (DC to DC ) which can convert 24 V input into -48, 5,3.3, and 1.8 V. Power conversion is done in three steps, first step convert 24 V input into 5 V and 3.3 V output using the Buck topology, second step convert the 24 V into 3.3V using again the Buck topology, third steps convert 24 V into -48 V using positive to negative Buck-Boost topology.
  • PPP Modem Drivers: Write the modem drivers for the new generation radio Proteus AMT. Nucleus RTOS was used to writing the Hynes compatible drivers. The drivers uses the CHAP protocol for authentication, TCP/IP is used for transporting, and used MPPC for the compression.
American Video EquipmentsHouston, TexasDigital Design Engineer08/1997 to 10/2000Digital Design Engineer Designed and developed firmware(s) and software(s) in VERILOG, Assembly, and C language for CCTV products.
MCI TelecommunicationsEngineer I05/1997 to 07/1997Responsible to provide the second level technical support for Network MCI business applications that's include the Internet MCI products, email, paging, and other business applications.
American Video Equipment08/1997 to 10/2000
  • Color & B/W 16 channel Video Multiplexer: Designed and developed hardware of video multiplexer that support up to 16 cameras input. The project was the modification of the ASIC based designed to FPGA based design. Some of the discrete components of ASIC based designed were implemented inside the FPGA design. The design errors of the ASIC based design were fixed in the new design. Following hardware and software were used in the project.
  • Video Serial Interface (VSI): Video serial interface get the serial data from RS232, RS485, and TTL device and add that data in the video signal. Several cash registers interfaces, Automated teller machines (ATM), Global positioning system interface were designed using the VSI. Following are the hardware and software is used in this project. Hardware: SFT80F55 (microcontroller), MB88056 (Fujitsu text inserter), RS232, EPROM, SRAM Software: 8051 (Assembly)
Education and Training
Masters of Electrical Engineering:TelecommunicationUniversity of Houston, Houston, Texas, USMasters of Electrical Engineering (Telecommunication) University of Houston, Houston, Texas, USA. Date of graduation: Spring 2001
Bachelor of Science:Electrical EngineeringUniversity of Houston, Houston, Texas, USBachelor of Science in Electrical Engineering (Computer Engineering) University of Houston, Houston, Texas, USA. Date of graduation: December 1996
Bachelor of Science:PhysicsUniversity of Karachi, Karachi, PKBachelor of Science in Physics University of Karachi, Karachi, Pakistan. Date of graduation, August 1993
Skills
Field Programmable Gate Array, Firmware, Fpga, 10 Base T, Authentication, Bga, Board Design, Class, Coding, Comprehensive Large Array Data Stewardship System, Drivers, Ds1, Ds3, Dsx, E1, E3, E-carrier, Emc, Emi, Emi/emc, Ethernet, Fcc, Flash, Jtag, Lims, Microwave, Modem, Oc3, Optical, Pll, Power Conversion, Ppp, Rtos, Sdram, Sec, Signal Processing, T1, T-carrier, Tcp, Tcp/ip, Tdm, Testing, Vhdl, Wireless, Wireless Radio, Xilinx, Engineer, Analog Silicon, Design Engineer, Software Engineer, Assembly, Ansi, Etsi, Iso, Iso 9000, Iso Standards, Test Fixtures, Application-specific Integrated Circuit, Asic, Cash, Cctv, Digital Design, Global Positioning, Rs232, Sram, Verilog, Ac/dc, C++, Dc Power, Embedded Software, Hardware Design, Power Supplies, Schematic, Software Design, Technical Support, Electrical Engineering, Telecommunication
Build Your Own Now

DISCLAIMER

Resumes, and other information uploaded or provided by the user, are considered User Content governed by our Terms & Conditions. As such, it is not owned by us, and it is the user who retains ownership over such content.

Resume Overview

Companies Worked For:

  • Microwave Networks Inc
  • American Video Equipments
  • MCI Telecommunications
  • American Video Equipment

School Attended

  • University of Houston
  • University of Karachi

Job Titles Held:

  • co-project Lead
  • Digital Design Engineer
  • Engineer I

Degrees

  • Masters of Electrical Engineering : Telecommunication
    Bachelor of Science : Electrical Engineering
    Bachelor of Science : Physics

Similar Resumes

View All
Lead-resume-sample

Lead

Marsden Building Maintenance Co

Minneapolis, Minnesota