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Jessica Claire
, , 100 Montgomery St. 10th Floor
Home: (555) 432-1000 - Cell: - resumesample@example.com - -
Summary
  • Engineering Tech Lead with 10+ years of experience of working on development projects in leading scientific areas. Over the years my role has involved R&D for designing products and processes responsible for the program's success.
  • Currently I lead development programs for a MEMs company providing custom solutions for a diverse customer base for applications ranging from inertial sensors, Lidar, waveguides, VR display, to microfluidics.
  • Highly organized, proactive and adaptable with strong work ethic and motivation to thrive in team-based or individual settings. Attention to detail, scientific rigor, and persistence are some of my strengths. Skilled at meeting challenging objectives and tight deadlines.
Skills
  • Applied Physics
  • Materials Science
  • MEMS Devices
  • Process Engineering
  • Metrology (SEM, FIB, AFM, XRD)
  • Deposition: PVD, CVD, Evaporators
  • Lithography (E-beam, Photo)
  • Dry Etch (DRIE, RIE, Mill)
  • Six Sigma Methodologies
  • Statistical Data Analysis
  • Design of Experiments, FMEA
  • Python, JMP
Experience
11/2019 to Current
Tech Lead Arisglobal Miami, FL,
  • Led R&D for development programs to transform early concept designs to working prototypes. Experience of working on programs with wide-range of applications like – MEMS inertial sensors, silicon optical benches (SiOB), developing grayscale lithography for micro-lens, IR sensors, microfluidics, microneedles, VR display, Lidar, etc.
  • Led cross-functional team efforts to integrate all technical aspects (additive, subtractive, and metrology) of the projects.
  • Reviewed and vetted programs in pre-PO phases for technical feasibility.
  • Derived and interpreted customer’s technical and business requirements to create roadmap for delivering prototype.
  • Worked on new confidential projects of prime strategic importance. Reported directly to VP of Engineering to keep upper management informed, and to reach the goals.
01/2018 to Current
Sr. Integration Engineer Paypal California, MD,
  • Defined technical integration strategy and developed integration plans.
  • Created technical reports, troubleshot issues, recommended design changes, and scale-up strategies for pilot production.
  • Improved silicon optical mirror etch process resulting in yield increase from existing
  • Led novel grayscale lithography project to create microlens arrays
  • Improved work processes and trained employees. Recommended corrective and preventive actions to boost product reproducibility and reliability.
10/2013 to 01/2018
Sr. Research Associate Amazon.Com, Inc. San Antonio, TX,
  • Key member in U.S. national project on design and development of the latest generation mm-wave camera (Project SPT-3g) Fabrication design involved complex 20+ wafer level processing steps and was designed to be ~10 times higher in efficiency as compared to previous generations. This camera has been operational at the NSF South Pole research station in Antarctica since December 2017.
  • Investigated materials (reactive sputtering, E-beam evaporator, PECVD), and device schemes, for next generation detectors including CMB-S4. Maintained detailed records of experimental protocols and data in laboratory notebooks.
  • Managed thin-film deposition tools, and set-up for electrical testing on device scale. Published technical reports and peer-reviewed journal papers.
09/2011 to 10/2013
Postdoctoral Research Fellow University Of Michigan Ann Arbor, MI,
  • Designed and conducted series of experiments to investigate nature of tunneling in low dimensional (2D electron gas) GaAs/AlGaAs heterostructures. Identified relevant questions and determined best methods for data collection at 30mK.
  • Directed study approaches by recommending, developing and executing strategies.
  • Microfabricated 50um thin devices (E-beam, litho, evaporation) with gates connections on both sides for electrical measurements.
  • Mentored undergraduates for microfabrication and to run He3 fridge
Education and Training
Expected in 08/2010
Ph.D.: Physics
Michigan State University - East Lansing, MI,
GPA:
  • Dissertation topic: Spin-Triplet Josephson junctions and GMR devices
  • 3.84 GPA
  • College of Natural Science, Dissertation Fellowship, Michigan State University 2009-2010
  • Recipient of Sherwood K Haynes “Outstanding Doctoral Student of 2010” Award Recipient
  • American Physical Society Student Member
Expected in
Master of Science: Physics (Minor: Materials Science)
University of Pune - Pune, India,
GPA:

Thesis topic: Synthesis of LCMO composite using solid state reaction route & study of thin films deposited using pulsed laser deposition

Accomplishments
  • Proud member of NSF team that built the SPT-3G telescope, currently installed in Antarctica for detecting cosmic microwave background (CMB)
  • Physical Sciences and Engineering Directorate Excellence Award, Argonne Natl. Laboratory, 2017
  • Recipient of Sherwood K Haynes “Outstanding Doctoral Student of 2010” Award
  • Reviewer for scientific journals – Physical Review Letters, 2D Materials, Journal of Low Temp Phys., and Supercond. Sci. Technol., and Journal of Phys. D. Applied Physics.
  • Spin Triplet work was cited 500+ times, and was highlighted in Nature Physics, Physics Today, and PRL Physics News.
  • Complete list of publications can be provided upon request. Total citations >1000, H-index of 15
  • Six Sigma Green Belt Certification (ASQ CSSGB), 2020
  • Proud to be recognized by management as the go-to development engineer at Atomica for solving unique Process Engineering challenges.

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Resume Overview

School Attended
  • Michigan State University
  • University of Pune
Job Titles Held:
  • Tech Lead
  • Sr. Integration Engineer
  • Sr. Research Associate
  • Postdoctoral Research Fellow
Degrees
  • Ph.D.
  • Master of Science