Skilled Senior Process Engineer with 7+ years of experience in Semiconductor Industry working with 200mm silicon substrate. Background includes process development, statistical analysis of data, implementation of SPC, working in a 24X7 clean room manufacturing environment and resolving high volume manufacturing problems
Perform root cause analysis to improve line yield by querying data using statistical tools like Excel, My SQL, JMP.
Tool Ownership for automated, manual and metrology tool
Create SPC charts for reducing scraps and create an out of control action plan (OCAP) to disposition parts to reduce downtime.
Add preventive maintenance jobs to improve tool uptime and create work instructions for operations to perform daily activities.
Analyze equipment failure rate and source parts as spare to improve tool uptime.
Tool Qualification – Automated Electroplating equipment (Stratus S-300 Nexx)
Managed project on creating an equipment procurement spec to source a $3.3M automated electroplating tool.
Qualified the tool for production by performing DOE and gauge R&R studies.
DOE compromised of base lining defectivity, optimizing mechanical parameters to reduce defects, minimizing substrate to substrate variation on processed parts.
Documented preventive maintenance procedure, operator work instruction, added spares to reduce tool downtime.
Yield Improvement – Reduction in defectivity by optimizing parameters
Reduce die scrap percentage from 2.75% to < 1%,="" reduced="" cost="" by="" $200k="" on="" quarterly="">
Queried data and performed commonality studies to understand root cause.
Used JMP and modified parameters in the process to reduce die scraps.
Reduction in wafer scrap (Process Related) – SPC control and reclaim
Reduced purchasing cost of chemicals (containing precious metal) by $0.5M on quarterly basis and reduced wafer scrap event.
Implemented a testing setup to validate if process excursion was related to hardware or external source.
Implemented preventive maintenance plan on a biweekly basis and worked on a reclaim process to reduce expense.
Scaling and transferring process from R&D to high volume manufacturing tools.
Proficient user for SEM, EDAX and Optical scopes to characterize defects and perform root cause failure analysis.
Experience with creating work instruction, training plating operators and writing standard operating procedures for maintenance and chemical preventive methods.
Tool modification – Adding Capacity for production needs (Raider-S Automated)
Worked on project to retrofit an existing hardware to increase production capacity by 5X.
Reviewed the fluidic and electric schematic to retrofit the plating tank with chilled water.
After implementing the hardware change weekly outputs increased from 10 to 60 substrate outs (500%).
Yield Improvement – Decreased scrap percentage from 25 to 1%
Analyzed final substrate profile by plotting X, Y co-ordinate and mapping out of spec scraps.
Modified design mask to reduce out of spec events after finding repeatable scrap pattern.
Able to reduce out of spec scrap events from 25 to 1% by providing feedback to design team.
Qualification of Thin Film Measurement tool – XRF Qualification
Sourced and spec'd two $200K thin film measurement tool.
Conducted DOE and Gauge R&R studies to understand variance in measurement.
Improved measurement accuracy of the tool by 8% in repeatability by reducing movement and adding vacuum stage.
Reduction in wafer scrap (Equipment Related) – Adding Equipment PM
Reduced wafer scrap event on Quarterly basis by understand MTBF on multiple equipment's.
Added multiple hardware PM to reduce quarterly.
Experience with formulating work for electroplating chemistry for rare metals and experience with catalyst, high-density polymers, resins, conductive inks, thin film coating will be considered.
Experience with plating processes used in the semiconductor industry: electroplating, electro-less plating, surface treatment, reverse and step plating for MEMS application.
Experience with encapsulation, electroplating of non-conductive material and testing of electroplated material.
Experience with performing IQA on rare electroplating chemistry and maintaining incoming quality of chemical from the supplier.
Setting up, qualifying new electrochemistry equipment and chemistry method development (CVS, RDE, ICP, HPLC, Thermo-gravimetric analysis and UPLC).
Reddy MihirPatent 16/042947Patterning of electroless metals by selective deactivation of catalysts November 15, 2018
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