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Lead Electrical Engineer Resume Example

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Jessica Claire
  • Montgomery Street, San Francisco, CA 94105
  • H: (555) 432-1000
  • C:
  • resumesample@example.com
  • Date of Birth:
  • India:
  • :
  • single:
Professional Summary
Progressive eletrical engineering experience in Oil & Gas and semiconductor industries involving hardware design, testing, yield improvement, research and development, project management and client interface.
Skills
C, C++, BASIC, Verilog, VHDL, Assembly, LINUX, UNIX, WINDOWS. EDA Tools: PSPICE, Cadence Virtuoso. SAP, ERP, Microsoft Office, MathCAD, MATLAB, AutoCAD, MPLAB IDE, LabVIEW.
  • Semiconductor process system
  • Advanced critical thinking
  • System-level electrical design and integration
Work History
Lead Electrical Engineer, 09/2012 to 09/2014
Honeywell New Jersey, NJ,
  • Rendered technical drawings and electrical systems specifications that exceeded company standards.
  • Performed in-depth electrical acceptance testing of completed hardware, including continuity and high potential isolation testing.
  • Monitored the manufacture of electrical devices and operations to ensure compliance with safety protocols.
  • Troubleshot electrical equipment problems such as electro-valves and sensors.
  • Managed engineering changes using SAP systems.
  • Performed load calculation for sizing wire and circuit protection.
  • Collaborated successfully with cross-functional development teams to design and manufacture new products.
  • Monitored installation and operations to consistently meet rigorous customer requirements.
  • Applied principles of electrical theory to advance and improve product development and efficiency.
  • Wrote protocols, qualification documents, test plans and test reports for quality assurance purposes.
  • Designed and approved power distribution requirements for the construction of high tech manufacturing facilities.
  • Implemented and approved design control procedures for electrical development in accordance with FDA guidelines.
  • Initiated a project management knowledge study and subsequently standardized project management practices.
  • Mentored junior engineers and new hires to better improve the competency and efficiency of all staff.
  • Continually improved methods and procedures for processes, measurement, documenting and work flow techniques.

Lead engineer, to
, ,
  • in the New Product Introduction (NPI) group incharge of projects RamTel Plus and ROV Subsea Display.
  • Concept and Planing: Performed trade studies for component selection and make functional and design improvement to existing designs.
  • Developed design requirements, specifications and test plans including validation of tolerances, form/fit/function, shock and vibration, safety, reliability, thermal generation and system power measurements.
  • Held conceptual deisgn and program cross functional reviews.
  • Performed failure analysis, identify alternative design strategies and finalize priliminary design approach.
  • Developed project plan with MS Project, identify and manage resources to ensure timely execution.
  • Design and development: Designed a remote terminal unit (RTU) to read subsea ram pressure, position, accumulator pressure and HPHT sensors and interface with the surface communication system with MODBUS over RS485.
  • Display the same information subsea on BOP mounted displays and provide an interface for ROV to plug in and extract data.
  • Designed power supplies with 50W and 100W DC/DC capacity, built in redundancy, power isolation and ground fault detection features.
  • Review PCB layouts for the power supplies in OrCAD.
  • Designed a subsea battery backup that will run the critical sensors, I/O modules and subsea displays when power is not available from the surface control system.
  • Developed single line diagrams, unit and system electrical schmetics and review mechanical assembly drawings with AutoCAD.
  • Conducted reliability study with ReliaSoft software for all electrical components.
  • Collaborated with mechanical team to design RTU enclosures for subsea application, conduct thermal analysis, mechanical stress analysis, pressure analysis and conduct design reviews for the same.
  • Conducted priliminary and detailed technical reviews of distributed I/O design, power supply design, system interfaces, ProE models, AutoCAD drawings and design documents per applicable codes (API, IEC, DNV).
  • Drove cross-functional relationships with sourcing, manufacturing, field service and others to ensure robust product design.
  • Collaborated and communicated with management, internal and outsourced development partners regarding design status, project progress and issue resolution.
  • Test and Validation: Tested and calibrated vendor supplied LVDTs, pressure transducers and subsea displays.
  • Performed functional electrical unit test for each component of the system.
  • Performed system integration testing and collaborate with software development team in China to debug, develop and integrate product software into final control system software.
  • Conducted environmental testing per API and DNV standards including thermal (hot and cold) testing, shock and vibration testing simulating subsea environment.
  • Hydrostatic pressure testing for the entire assembly to qualify to work at 12500ft.
  • Provided engineering support during FAT and remote support during offshore troubleshooting.
Device Engineer, 07/2007 to 09/2012
Newcrestimage Rockford, IL,
  • Primary technical interface to an external semiconductor mfg facility for new product introduction of 8, 16 and 32 bit microcontrollers.
  • Responsibility added as part of career progression.
  • Increased first pass yield on over 30 products by analyzing product test results, wafer acceptance test data and initiating appropriate design & process modifications.
  • Analyzed electrical parametric data from test chips and developed design rules for placing devices, such as transistors, resistors and capacitors under bond pad to increase area utilization on silicon wafer.
  • Performed electrical engineering calculations to determine effects of varying process conditions such as diffusion time, temperature, dosage, etch time etc.
  • on transistor's electrical performance.
  • Led device characterization such as transistor gate length, threshold voltage and source line resistance variations and successfully implemented them on pilot engineering lots.
  • Developed applications for Motor Control, LED display, A/D-D/A interface, timers and counters with MPLAB integrated development environment.
  • Proficient in 8, 16 and 32 bit microcontroller programming.
  • Collaborated with R&D and test groups to resolve product design issues and aid design for manufacturability.
  • Conducted surface analysis of silicon, ceramic and polymer substrates with Veeco NT 3300 profilometer post metal evaporation, photolithography and etching.
  • Performed electrical testing using Keithley 6487 leakage current measurement tool, HP 4192 LF impedance analyzer and four- point probe resistivity measurement tool.
  • Developed Design of Experiments (DOE) using JMP software for implementation on key component building manufacturing processes such as photolithography, metal evaporation, metal and polymer film etching.
  • Developed and successfully implemented a centralized stream out procedure and improved tape out to mfg cycle time by 50%.
  • Reviewed and approved Engineering Change Notices (ECN), Standard Procedure Instructions (SPI) and design rule documents.
  • Prepared Bill of Materials (BOM) for products manufactured at external semiconductor fabs.
Education
M.S: Electrical Engineering, Expected in Dec 07
to
University of Central Florida - ,
GPA:
Electrical Engineering 3.8/4.0 Developed an electro-static valve assembly for electro-mechanical systems used in sub-zero temperatures.
B.S: Instrumentation & Control Engineering, Expected in Jun 04
to
Gujarat University - ,
GPA:
Instrumentation & Control Engineering 3.8/4.0
Automation training: Siemens S7 300/400 hardware configuration and programming with PLCSIM. Mar 15: , Expected in
to
- ,
GPA:

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Resume Overview

School Attended
  • University of Central Florida
  • Gujarat University
Job Titles Held:
  • Lead Electrical Engineer
  • Lead engineer
  • Device Engineer
Degrees
  • M.S
  • B.S
  • Automation training: Siemens S7 300/400 hardware configuration and programming with PLCSIM. Mar 15