To secure a Senior Failure analysis position where my technical expertise and over 10 years of experience in electrical/physical failure analysis engineering on integrated circuits will be beneficial to the company. Capabilities Profile Good knowledge of Analog/Digital integrated circuits Hands on experience in semiconductor Failure Analysis and Product Quality engineering Knowledge of Test and Product Engineering flows Outstanding people skills, excellent presentation and communication skills
Hardware description languages Verilog, VHDL
Tools Mentor Modelsim Leonardo, MentorGraphics, Knights and Cadence
Programming Languages C, Visual Basic 6.0
Operating Systems UNIX, Windows, DOS, MAC
Packages MS Office Suite (Excel, Word, Power-point and Access)
Outstanding people skills, excellent presentation and communication skills
Staff Failure Analysis Engineer September 2006 to CurrentInfineon Technologies － Temecula, CA
Performed Failure Analysis on various power management semiconductor packages/devices (Multichip Modules, Monolithic ICs, power MOSFETs, and IGBTs) which have applications in areas of consumer and Industrial.
Worked on low voltage mixed signal integrated circuits (LVICs), LVIC modules, digital controllers, drivers, buck converters used for various loads to drive power MOSFETs and IGBTs.
Worked on different IC technologies (CMOS, BiCMOS, C025, TSMC, BCD7, Gen10.59, and Gen12).
God understanding of analog and digital circuit blocks: LDO, driver/pre-driver, buffers, FF, ADC/DAC, Op-amp, logic gates, trim, band gap etc.
Used various failure analysis tools: Optical microscopes, X-ray, SEM/EDX, FIB, SAM, RIE, Allied polishing tools, Ultra tech, Chemical Jetetch, Laser, micro-manipulators for micro-probing.
Used chemicals for decapsulation and layer by layer delayer of devices.
Used fault isolation tools/techniques: XIVA, photo-emission, Obirch, Liquid crystal, thermal imaging, Design of experiments (DOE), and circuit micro-probing.
Very well in reading/understanding/analyzing devices in layouts and schematics using Cadence and Knights for micro-probing/correlating the failure to the failing circuit/block/component.
Used curve tracers, power supplies, source/multi meters, oscilloscopes, parametric analyzers for bench setups and RTI multitrace to curve trace and analyze I-V curves.
Good in interpretation of ATE data logs and translating the ATE failure mode into simple to semi complex bench test setups which were used for fault isolation and micro-probing.
Performed Failure Analysis on devices at Wafer, Packaged (plastics and ceramics), Substrate, BGA, LgA, and bumped Dies.
Worked on failures: Opens, shorts, leakage, parametric, functional, power loss, trim and Rdson etc.
Interaction during analysis with Quality, Reliability, Product, Design, application, Process, and ATE test engineering teams in the interpretation of failure analysis findings and root cause analysis.
Prepare FA reports for internal/external customers to implement corrective actions and continuous improvement plans (CIP) from FAB, assembly, and Test engineering for immediate containment on quality spill and then later a permanent corrective action.
Complete failure analysis jobs according to established cycle times.
Involved/lead the team on safe launch of new products (weekly meetings). It's a proactive measure/approach to monitor/analyze the final test yield data and identify top-3 failures and perform failure analysis for the root cause to improve yield and implement CIP/corrective action if needed.
Generate Failure Analysis reports that are detailed, accurate, concise and timely in accordance with the process flow & develop appropriate conclusions based upon physical/electrical results to assist customers, applications, manufacturing, & test in the elimination of reject or failing parts.
Prepared quarterly PPM (parts per million) metrics on quality performance for higher management which helped in monitoring of product performance.
Perform tool evaluations and participate in defining future tools required to support products and technology.
Failure Analysis Engineer December 2004 to September 2006Texas Instruments Inc － Dallas, TX
through Priority Labs Inc.)
Expertise in FA engineering
Used FA equipment like Emission Microscopy, Infrared Microscopy, Scanning Acoustic Microscope, Scanning Electron Microscope, Voltage and Current source meters, Multimeters, Characterizing equipment etc.
Performed analysis on Digital/Analog circuits of engineering evaluation, reliability, and customer return parts
Performed bench testing for devices failing functional, parametric, IDDQ and continuity
Very good in isolating the reported customer failures to the component level using the above mentioned test equipments and also techniques like Liquid crystal, Emmi, OBIRCH, IREM, FIB, Micro probing
Interacted with Design/Product Engineering to facilitate efficient solutions
Deprocessed devices layer by layer using both chemical and parallel polish method
Performed final revision to the failure analysis reports before sending to customers. This involves Microsoft Office documentation and use of imaging software.
Performed Failure Analysis on Analog/Digital integrated circuits for different fail modes including continuity, functional, parametric and IDDQ
Correlate failure circuitry of the device to Cadence layout
Able to read the data logs from testers like VLCT, Fusion and Teradyne
Worked closely with Product & Design Engineering
Used different failure analysis equipment Curve Tracer, Liquid Crystal, SAM (Scanning Acoustic Microscope), SEM (Scanning Electron Microscope), EMMI (Emission Microscope), TDR (Time Domain Reflectometer) and X-Ray analysis to determine the root cause of device failure
Used different acids for deprocessing units
Generated Failure Analysis Reports describing failure modes and causes
Received professional level training in ESD (Electro Static Discharge) handling
Received a superior performance rating for the overall work done during the period Corporate Trainings:
Trainings on ESD, radiation, Security awareness, CSR, Fire extinguisher, Ergonomics, Illness prevention
Courses on Global corruption, bribery and Gifts on gratuities
HazCom / Chemical Safety Training
OSHA Laser Safety Training
Lead safety Training
Prevention of Sexual Harassment in the Workplace
The "5S" Philosophy
MS : Electrical EngineeringSouthern Illinois University Edwardsville － Edwardsville, IL, USMS in Electrical Engineering Dec 2002 Southern Illinois University Edwardsville (SIUE), Edwardsville, IL
BS : Electronics & CommunicationOsmania UniversityBS in Electronics & Communicatio Jun 1998 Osmania University, India Personal: U.S. permanent resident. I am versatile, highly motivated, self-directed. I'm a team player who thrives on challenge. I'm interested in learning new skills, quick learning ability, good interpersonal skills and effective working alone or in a team environment. I have ability to work with cross-functional groups. Ability to manage multiple projects, complete tests and resolve problems in an unattended manner. No issue in relocating.
Analog, Circuits, Emission, Engineer, Failure Analysis, Failure Analysis Engineer, Parametric, Imaging, Cadence, Integrated Circuits, Laser, Search Engine Marketing, Sem, X-ray, Adc, Analog/mixed, Assembly, Ate Test, Bga, Bicmos, Ceramics, Cleanroom, Cmos, Continuous Improvement, Corrective Action, Dac, Drivers, Low Voltage, Metrics, Million, Mixed Signal, New Products, Optical, Oscilloscopes, Plastics, Power Supplies, Proactive, Process Flow, Root Cause Analysis, Schematics, Self Motivated, Semiconductor, Test Engineering, Translating, Wafer, Acoustic, Microscope, Scanning, Scanning Electron, Scanning Electron Microscope, Analog Circuits, Analog Design, Design Product, Digital/analog, Documentation, Imaging Software, Infrared, Microsoft Office, Ms Office, Multimeters, Product Engineering, Solutions, Testing, Analog/digital, Chemical Safety, Circuitry, Csr, Design Engineering, Ergonomics, Esd, Failure Modes, Machine Safety, Safety Training, Security, Teradyne, Time Management, Training, Access, Dos, Excel, Mac, Mentor, Mentorgraphics, Unix, Verilog, Vhdl, Visual Basic, Visual Basic 6.0, Word, Electrical Engineering, Self-directed, Team Player