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Pest Technician Resume Example

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PEST TECHNICIAN
Summary
To obtain a challenging position in the semiconductor industry.
Highlights
  • Modern electronic-electronic communication theories
  • Analysis, troubleshooting AC and DC circuitries of series, parallels, transistors, and integrated circuitries
  • Build prototype using breadboard
  • Familiar with electronic diagnostic test equipment: oscilloscope, digital and analog multi-meter, power supply, power generator function, probe logic, and setting up fixed power supply as required
  • Identify operation of basic logic circuits: OR, NOR, AND, NAND, EX-OR, EX-NOR, also JK flip-flops and counters
  • Solder and desolder components, printed circuit boards, reading schematics
  • Familiar with computer component ( microcomputer: A+ ) and microprocessor and industry application (basic low and high level programming) using programming logic controller
  • Familiar with C + +: basic language programming using structure control, strings array, arrays, and class structure
  • Familiar with Transport systems
  • Familiar with Data Communications
  • Familiar with Switching systems
Experience
Pest Technician
January 2009 to January 2012Company Name － City, State
  • Provide pest management services for residential, industrial and commercial customers.
Pest Technician
January 2012 to January 2014Company Name － City, State
  • Provide pest management services for residential, industrial and commercial customers.
Sales Representative
January 2008 to January 2009Company Name － City, State
  • Customer service, door to door sales & presentation, cold market prospecting, phone sales & telemarketing.
  • Inbound & outbound calls.
Financial Representative
January 2003 to January 2007Company Name － City, State
  • Assisting customers with finances; debt consolidation, refinancing mortgages, student and personal loans.
  • Recruiting and sales, product and field training, oral presentations.
  • Inbound and outbound sales calls, cold market prospecting, customer follow up and retention.
R & D: Ink Jet/ Encapsulation Technician
March 2002 to November 2003Company Name － City, State
  • Printing Pedot and Polymer into the substrate by pixels/wells using Microfab equipment.
  • This requires precise data entry and elaborate parameter setups.
  • Operate contact angle tool to determine surface tension of fluid (Pedot or Polymer) behavior to maximize the printing process and provide accurate reading of surface tension.
  • Encapsulation processing: Use glove box for better sealant of moisture level in the control atmosphere environment.
  • Dispense precise amount of an epoxy into the substrate or panel using software program.
  • Carefully control of epoxy dispensing, set up all necessary parameters such as needle heights sensor, vacuum control, speed of dispense, and camera setting for accurate alignment.
  • Ensure correct parameter setup and encapsulation to prevent moisture from entering the part.
  • Scribe encapsulation lids or displays panel by manual and advanced automatic scribing equipment.
  • Use delicate precise pressure without shattering glass or lids.
  • Set up encapsulation dispensing mode as required.
  • Evaluate new epoxy and curing methods for preproduction line plus R&D process.
  • Evaluate sealant process, conduct pixel shrinkage study for life time efficiency.
  • Evaluate defects of process: voids, delamination, nitrogen compressed when sealant process is being done over/under compressed.
  • TGA Analysis: Conduct thermal analysis for weight gain on materials ( Getter Tablets, Liquid getters, and Paste getters ) utilized for research and development for better study of its effectiveness of the getter absorbance of the moisture gain level.
  • Evaluate new getters for weight gain and absorbance.
  • Romulus (Mechanical test equipment): Conduct the experiment of stud pull and die shear on an adhesive behavior and its strength of sealant under certain parameters ( 60/90 or 85/85 or 60 C and 90% humidity).
  • Evaluate performance of adhesive strength under certain conditions.
Mechanical Assembler
January 2000 to June 2000Company Name － City, State
  • Assemble electronic components (relay switches) using bread board depending on customer's preference.
  • Read and build circuitries using schematics.
  • Solder electronic components.
  • Build and troubleshoot circuitries bread boards as required.
Wafer Operator
August 1995 to December 1998Company Name － City, State
  • Troubleshoot equipment used in production and monitor daily diagnostic results for trends indicating pending failures or degrading of quality in products.
  • Operate electronic equipment and analyze quality control pass/fail of production.
  • Perform daily diagnostic tests on measuring criteria and perform preventive maintenance tests as required.
  • Depositing/stripe off photoresist on the wafers by using a photoresist coater.
  • Perform SEM/CD SEM for better understanding of defects, CD SEM determines track width and overlay of wafer's thickness each layer or device that has been processed.
  • Operate stepper for depositing each layer onto the wafer exposed on the photoresist soft surface/tension.
  • Safety and Human Error team member for accident prevention and safe work methods.
Assembly Operator
May 1994 to July 1995Company Name － City, State
  • Assemble skateboards and run shipping room as required.
  • Operate UV sealer for coating and finish products.
  • Silk screening (printing) T- Shirts of corporation's logos.
  • Operate supple mating equipment which printed designed corporation's boards and other products, depending on customer's need.
Education
Bachelor of Science : Telecommunication Engineering Technology, 3 2002ITT Technical Institute － City, StateTelecommunication Engineering Technology
Associate of Science : Electronic Engineering Technology, 3 2001ITT Technical Institute － City, StateGPA: GPA: 3.7 EET Outstanding Student AwardElectronic Engineering Technology GPA: 3.7 EET Outstanding Student Award
Skills
A+, basic, C, C + +, CD, oral, controller, Customer service, Data Communications, data entry, DC, logic, logos, market, materials, Mechanical, multi-meter, oscilloscope, camera, power supply, presentations, programming, quality, quality control, reading, Read, Recruiting, research, Safety, sales, schematics, shipping, Silk, switches, telemarketing, phone, test equipment, Troubleshoot, troubleshooting, UV
Additional Information
  • Producer Life Insurance License- State of CA & MN Loan Originator License- State of CA Health Insurance License- State of CA
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Resume Overview

School Attended

  • ITT Technical Institute

Job Titles Held:

  • Pest Technician
  • Sales Representative
  • Financial Representative
  • R & D: Ink Jet/ Encapsulation Technician
  • Mechanical Assembler
  • Wafer Operator
  • Assembly Operator

Degrees

  • Bachelor of Science : Telecommunication Engineering Technology , 3 2002
    Associate of Science : Electronic Engineering Technology , 3 2001

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