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Process and Systems Engineering Manager Resume Example

Resume Score: 90%

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PROCESS AND SYSTEMS ENGINEERING MANAGER
Profile

Accomplished engineering with significant experience in printed circuit board manufacturing processes and front end engineering experience (CAD/ CAM, Drill, Rout, Scoring, and Electrical testing programming and all the manufacturing processes). Oversee FMEA, submission of PPAP, APQP, PW, GR&R and work with supplier quality, QS/ISO 9000, UL and ITAR.

Skills

COMPUTER SKILLS Good IT skill. Windows 7, Excel, PowerPoint, Word, Statistical, ALL Clear Flowcharting, , CAM350 (CAD), Bacon Software (manufacturing software). Using QI-macros, Minitab and Excel for all the SPC, DOE, FEMA, PPAP, Control Plan 8D's root cause analysis. PPAP, Control plan, processes flow chart, GR&R and FEMA using ASIDatamyte MPACT software trained.

Accomplishments

Created process controls for Plasma System for Teflon, Getek, Polyimide, and Hybrid circuit with small hole, fine line including blind, buried, and high aspect ratio hole plating for Multilayer Process for up to 12 layers. Improved flying probe, grid electrical testing procedure, and fixturing methods,

QS/ISO 9000 Certification, UL projects and ITAR. Achievement

Oversee FMEA, submission of PPAP, APQP, PW, SCAR, GR&R and work with supplier quality.

Implement Statistical process control on critical processes and lean and six sigma methods to achieve process improvements and Root cause analysis.

Professional Experience
Process and Systems Engineering Manager01/1996 to CurrentUnited Electronics CorpFranklin Park, IL
  • 60018, U.S.A Accomplished setting up, maintaining, trouble shooting (SPC, FMEA, DOE, lean and six sigma), and improving the following processes:
  • Front End Engineering (CAD, CAM, Drill, Rout programming and Electrical testing)
  • Drilling, Routing and Scoring
  • Image dry film, LPI,
  • Plasma and chemical de-smear
  • Black Hole and Electroless Copper Plating
  • Conventional Oxide and Oxide replacement
  • DC Acid Copper, Pulse plating
  • Cupric and Ammonia Etching
  • ENIG, ENPIG, Soft and Hard Gold, White Tin, and Silver
  • Multilayer up to 12layer with higher copper up to 6oz, Teflon Hybrids layers, blind and buried layers with impedance control.
  • MC (metal clad manufacturing) for LED applications.
  • Achieving UL, ISO, and ITAR projects
  • Helping customers, with all the technical related issues, DFM, impedance, and designing related questions.
  • Lean, 5's and six sigma manufacturing methodology (DMAIC) Created process controls for Plasma System for Teflon, Getek, Polyimide, and Hybrid circuit with small hole, fine line including blind, buried, and high aspect ratio hole plating for Multilayer Process for up to 12 layers. Improved flying probe, grid electrical testing procedure, and fixturing methods, QS/ISO 9000 Certification and ITAR. Achievement Oversee FMEA, submission of PPAP, APQP, PW, SCAR, GR&R and work with supplier quality. Implement Statistical process control on critical processes and lean and six sigma methods to achieve process improvements and Root cause analysis.
Process Engineer01/1987 to 12/1995Process and Production Engineering, Bel Tronics LTDFranklin Park, Ont

Canada Responsible for all the manufacturing process, and quality control Set up processes to manufacture High frequency (TEFLON) circuit boards from Engineering, CNC, CAD/CAM, and testing programming to final production process. Introduced Statistical process control (SPC), DOE, TQM, and FMEA through out the plant. Improved production capacity from 100 prototype Bds/month to 2000 production Bds/month Reduced manufacturing costs by 30%, over a period of 2 years.

09/1982 to 01/1986Franklin Park, England

September 1982-1986 EDUCATION B.S.E.E. (Electrical and Electronics Engineering Degree) - University of Willesden College of Technology, London, England.

Education and Training
Associate of Science1986University of Willesden College of TechnologyWillesden, London, England

B.S.E.E. (Electrical and Electronics Engineering Degree) - University of Willesden College of Technology, London, England.


Certifications

Humber College, Ontario, Canada

Statistical ProcessControl, FMEA

Multilayer Technology

Waste Management System

Printed Circuit Board Technology

Perry Johnson Registrars, Chicago, Illinois

QS/ISO 9000 Lead Auditor

Member: ASQ:

Six Sigma Black belt Theory

ASIDatamyte Training: APQP with MPACT software

SSBB Project (Six Sigma Black Belt Theory and Lab) Certified

Advance Statistic (SPC) certified

Affiliations
ASQ
Skills

FMEA, submission of PPAP, APQP, PW, GR&R and work with supplier quality, QS/ISO 9000, UL and ITAR.

Lean, 5's and six sigma manufacturing methodology (DMAIC)

Good IT skill. Windows 7, Excel, PowerPoint, Word, Statistical, ALL Clear Flowcharting,

Using QI-macros, Minitab and Excel for all the SPC, DOE, FEMA, PPAP, Control Plan 8D's root cause analysis.

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Resume Overview

Companies Worked For:

  • United Electronics Corp
  • Process and Production Engineering, Bel Tronics LTD

School Attended

  • University of Willesden College of Technology

Job Titles Held:

  • Process and Systems Engineering Manager
  • Process Engineer

Degrees

  • Associate of Science 1986

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